Description:

Hot melt pressure sensitive adhesives being 100% solid systems containing no solvent.

Low surface tack.

Good cohesion.

Pealable hotmelt for onsert applications.

It removes cleanly on numerous substrates, for example various paper stocks, envelopes, board stocks and othervarious substrates.

Properties, Specs & Testing Methods: see attached MSDS & TDS

Directions for Use: see attached MSDS & TDS